Excellent thermal stability of the base polymer.
Thermally conductive tapes are provided on a silicone treated polyester release liner.
Excellent adhesive performance with good wetting and flow onto many substrate surfaces.
Application:
Bonding heat sink for PCB and IC package.
Other cooling devices, fans, heat spreaders.
Mounting of IC, GPU, heat pipe and heat sink during assembly.
Other heat transferring applications in electronic and electric appliances.
Series: CB900
Structure:
|
 |
|
Liner |
 |
|
Thermally Conductive Acrylic Adhesive |
 |
|
Acrylic Foam |
|
|
Thermally Conductive Acrylic Adhesive |
| Grade No. |
|
Adhesive |
Peel Adhesion |
Shear Strength |
Thermal Conductivity |
Remark |
| |
(mm) |
Type |
(gf/25mm) |
(gf/cm2) |
W/m.K |
|
| CB925 |
0.25±50µm |
Acrylic |
≥ 2,500 |
≥ 5,000 |
0.8 |
White |
|
|
|
|
